Glass Processing
Please feel free to consult with us on anything related to glass processing. We are capable of working with a
variety of materials, including single crystal materials.
We stock a wide range of products from Corning, SCHOTT, and Eagle to meet the diverse needs of our
customers.
We have extensive experience with custom orders for lenses, mirrors, and prisms.
Even in cases where other companies may quote a high price, please do not hesitate to contact us.
Lens
Mirror
Color Glass
Prism
Beam splitter
ND Filter
Glass Cell / Fused Silica
Cell
<About Materials>
● Sapphire Glass ● Color Glass ● Fused Silica ● Chemically Strengthened Glass ● Blue Plate Glass ● White
Plate Glass
● Optical Glass (Equivalent to BK7) ● Heat-Resistant Glass (Tempax, Pyrex) ● Low-Expansion Glass
(Clearceram, Zerodur)
● Zero Expansion Crystallized Glass (Neoceram) ● Photomask Materials (Evaporated Substrates, Plated
Substrates) and more.
<About Processing Capabilities>
● Glass Polishing ● Cutting & Scribing ● Drilling ● Dicing & Machining
● Etching ● Coating & Deposition ● Machining and more.
Cold Ablation
Cold Ablation processing is a technology that enables precise microfabrication without leaving thermal
effects on the material.
This technique utilizes pulsed laser irradiation with ultra-short pulses, such as femtosecond lasers or
picosecond lasers.
In general, irradiation with ultra-short pulses shorter than 10 picoseconds generates minimal thermal
effects on the target material.
This makes it possible to microfabricate hard-to-process materials and high-hardness brittle
materials.
Its high peak energy induces nonlinear effects, which are used for cutting transparent materials and
micro-drilling.
Additionally, unique effects that do not appear in other laser thermal processes, such as generating
periodic structures on almost any material surface, have been observed, and the range of applications
continues to expand.
Glass
Cutting and Marking
Ceramic Processing
Drilling High-Hardness Brittle Materials
<Key Features>
High Peak Power:
The short pulse width generates high peak power, concentrating energy instantaneously at the focal
point.
Minimized Thermal Effects:
The extremely short pulse width completes processing before heat transfers to the material, reducing burrs,
cracks, and thermal deformation.
High-Precision Microfabrication:
Enables processing of fine structures and complex shapes, making it suitable for precision applications such
as electronic components and medical devices.
<Main Applications>
● Cutting: Dicing and micro-drilling of thin metal films, glass, sapphire, ceramics, and silicon
substrates
● Marking: Hydrophobic surface creation, QR code engraving, periodic surface structure formation, friction
reduction
● Modification: Optical waveguide formation, microchannel creation, micro-welding of transparent
materials