Glass Processing

Please feel free to consult with us on anything related to glass processing. We are capable of working with a variety of materials, including single crystal materials.
We stock a wide range of products from Corning, SCHOTT, and Eagle to meet the diverse needs of our customers.
We have extensive experience with custom orders for lenses, mirrors, and prisms.
Even in cases where other companies may quote a high price, please do not hesitate to contact us.

LensLens
MirrorMirror
Color GlassColor Glass
PrismPrism
Beam splitterBeam splitter
ND FilterND Filter
Glass CellGlass Cell / Fused Silica Cell
<About Materials>
● Sapphire Glass ● Color Glass ● Fused Silica ● Chemically Strengthened Glass ● Blue Plate Glass ● White Plate Glass
● Optical Glass (Equivalent to BK7) ● Heat-Resistant Glass (Tempax, Pyrex) ● Low-Expansion Glass (Clearceram, Zerodur)
● Zero Expansion Crystallized Glass (Neoceram) ● Photomask Materials (Evaporated Substrates, Plated Substrates) and more.
<About Processing Capabilities>
● Glass Polishing ● Cutting & Scribing ● Drilling ● Dicing & Machining
● Etching ● Coating & Deposition ● Machining and more.
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Cold Ablation

Cold Ablation processing is a technology that enables precise microfabrication without leaving thermal effects on the material. This technique utilizes pulsed laser irradiation with ultra-short pulses, such as femtosecond lasers or picosecond lasers. In general, irradiation with ultra-short pulses shorter than 10 picoseconds generates minimal thermal effects on the target material. This makes it possible to microfabricate hard-to-process materials and high-hardness brittle materials.
Its high peak energy induces nonlinear effects, which are used for cutting transparent materials and micro-drilling. Additionally, unique effects that do not appear in other laser thermal processes, such as generating periodic structures on almost any material surface, have been observed, and the range of applications continues to expand.

Glass Cutting and MarkingGlass Cutting and Marking
Ceramic ProcessingCeramic Processing
Drilling High-Hardness Brittle MaterialsDrilling High-Hardness Brittle Materials
<Key Features>
High Peak Power: The short pulse width generates high peak power, concentrating energy instantaneously at the focal point.
Minimized Thermal Effects: The extremely short pulse width completes processing before heat transfers to the material, reducing burrs, cracks, and thermal deformation.
High-Precision Microfabrication: Enables processing of fine structures and complex shapes, making it suitable for precision applications such as electronic components and medical devices.
<Main Applications>
● Cutting: Dicing and micro-drilling of thin metal films, glass, sapphire, ceramics, and silicon substrates
● Marking: Hydrophobic surface creation, QR code engraving, periodic surface structure formation, friction reduction
● Modification: Optical waveguide formation, microchannel creation, micro-welding of transparent materials
<Laser-Related Products>
Picosecond LasersFemtosecond Lasers ● Laser Beam Expanders ● fθ Scanner Lenses ● Laser Focusing Lenses ● Laser Via Cutter ● Debris Shields/Objective Protection SheetsBeam Splitters for LasersCameras for Process Observation
Inquiry
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